Capabilities
Manufacturing
SAS-Lansdale provides a vertically integrated manufacturing capability for electronic subsystems and components that includes:
- High complexity manufacturing of microwave and millimeter wave assemblies.
- Microwave module assembly including automatic epoxy dispense, automatic die attach, automatic wire and ribbon bonding and laser sealing
- MIL-STD-883 Screening
- Vertically integrated manufacturing of complex electro-mechanical assemblies.
- Automated/Semi-automated through-hole and surface mount component circuit card assembly manufacturing.
- Reflow/Wave soldering, conformal coating, real time x-ray inspection capabilities.
- Integration and assembly of RF, digital, high voltage, and high power assemblies.
- Magnetics/Transformer capabilities including toroid, bobbin and flat, progressive and bank winding for inductors, chokes, power transformers, and high voltage multi-tap transformers.
- CNC lathe, CNC machining centers, and tool & die capabilities with full support functions.
- Dedicated antenna assembly area with custom tooling for high precision and repeatability.
- On-site print and etch for spirals and baluns for cavity backed antennas.
Testing
SAS-Lansdale also provides a complete environmental test capability:
- Climatic testing with over 40 environmental chambers.
- Combined Temperature/Vibration test facilities to perform Environmental Stress Screening and Reliability Testing.
- Vibration/Shock testing with 10 electrodynamic systems, 1 electro-hydraulic system, 1 vehicle transport simulator, and various other mechanical shock instruments.
- Contaminant Environment including Explosive Atmosphere, Salt Fog, Windblown Dust, and Fluid Compatibility.
Complete test capabilities are provided for all components and subsystems to include:
- Classified automated hybrid/microwave test capabilities.
- Automated test of all levels of assembly (In-Circuit, Functional, Harness/DITMCO).
- Antenna element and array testing
- High power transmitter testing
